IDT70V15L15PFG
vs
70V15S15BF
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFP
CABGA
Package Description
14 X 14 MM, 1.40 MM HEIGHT, TQFP-80
,
Pin Count
80
100
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
15 ns
JESD-30 Code
S-PQFP-G80
JESD-609 Code
e3
e0
Length
14 mm
Memory Density
73728 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
9
Moisture Sensitivity Level
3
3
Number of Functions
1
Number of Terminals
80
Number of Words
8192 words
Number of Words Code
8000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
8KX9
Package Body Material
PLASTIC/EPOXY
Package Code
LQFP
Package Shape
SQUARE
Package Style
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
225
Qualification Status
Not Qualified
Seated Height-Max
1.6 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
3.3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
Matte Tin (Sn)
TIN LEAD
Terminal Form
GULL WING
Terminal Pitch
0.65 mm
Terminal Position
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
14 mm
Base Number Matches
1
2
Manufacturer Package Code
BF100
Compare IDT70V15L15PFG with alternatives
Compare 70V15S15BF with alternatives