IDT70V06S35PFI
vs
IDT7006S35PF9
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFP
QFP
Package Description
LQFP, QFP64,.66SQ,32
14 X 14 MM, 1.40 MM HEIGHT, TQFP-64
Pin Count
64
64
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
35 ns
35 ns
I/O Type
COMMON
JESD-30 Code
S-PQFP-G64
S-PQFP-G64
JESD-609 Code
e0
e0
Length
14 mm
14 mm
Memory Density
131072 bit
131072 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
8
8
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
64
64
Number of Words
16384 words
16384 words
Number of Words Code
16000
16000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
16KX8
16KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
LQFP
Package Equivalence Code
QFP64,.66SQ,32
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
240
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
1.6 mm
Standby Current-Max
0.015 A
Standby Voltage-Min
2 V
Supply Current-Max
0.2 mA
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
3 V
4.5 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Width
14 mm
14 mm
Base Number Matches
1
1
Additional Feature
INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN
Output Enable
YES
Compare IDT70V06S35PFI with alternatives
Compare IDT7006S35PF9 with alternatives