IDT70T3599S166BF vs 70P3599S166BF feature comparison

IDT70T3599S166BF Integrated Device Technology Inc

Buy Now Datasheet

70P3599S166BF Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA
Package Description TFBGA, BGA208,17X17,32 ,
Pin Count 208
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.B.2.A EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 12 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 166 MHz
I/O Type COMMON
JESD-30 Code S-PBGA-B208
JESD-609 Code e0
Length 15 mm
Memory Density 4718592 bit
Memory IC Type MULTI-PORT SRAM
Memory Width 36
Moisture Sensitivity Level 3
Number of Functions 1
Number of Ports 2
Number of Terminals 208
Number of Words 131072 words
Number of Words Code 128000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 128KX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA208,17X17,32
Package Shape SQUARE
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified
Seated Height-Max 1.2 mm
Standby Current-Max 0.015 A
Standby Voltage-Min 2.4 V
Supply Current-Max 0.45 mA
Supply Voltage-Max (Vsup) 2.6 V
Supply Voltage-Min (Vsup) 2.4 V
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 15 mm
Base Number Matches 1 1

Compare IDT70T3599S166BF with alternatives

Compare 70P3599S166BF with alternatives