70P3599S166BF vs IDT70V3599S166BFG feature comparison

70P3599S166BF Integrated Device Technology Inc

Buy Now Datasheet

IDT70V3599S166BFG Integrated Device Technology Inc

Buy Now Datasheet
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Package Description , LFBGA, BGA208,17X17,32
Reach Compliance Code unknown compliant
ECCN Code EAR99 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code BGA
Pin Count 208
Access Time-Max 12 ns
Additional Feature PIPELINED OR FLOW-THROUGH ARCHITECTURE
Clock Frequency-Max (fCLK) 166 MHz
I/O Type COMMON
JESD-30 Code S-PBGA-B208
JESD-609 Code e1
Length 15 mm
Memory Density 4718592 bit
Memory IC Type MULTI-PORT SRAM
Memory Width 36
Moisture Sensitivity Level 3
Number of Functions 1
Number of Ports 2
Number of Terminals 208
Number of Words 131072 words
Number of Words Code 128000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 128KX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA208,17X17,32
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.7 mm
Standby Current-Max 0.03 A
Standby Voltage-Min 3.15 V
Supply Current-Max 0.5 mA
Supply Voltage-Max (Vsup) 3.45 V
Supply Voltage-Min (Vsup) 3.15 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 15 mm

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Compare IDT70V3599S166BFG with alternatives