IDT70T25L20BF vs 70T25L20BF feature comparison

IDT70T25L20BF Integrated Device Technology Inc

Buy Now Datasheet

70T25L20BF Integrated Device Technology Inc

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA CABGA
Package Description FPBGA-100 10 X 10 MM, 1.4 MM HEIGHT, 0.8 MM PITCH, FPBGA-100
Pin Count 100 100
Reach Compliance Code not_compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 20 ns 20 ns
JESD-30 Code S-PBGA-B100 S-PBGA-B100
JESD-609 Code e0 e0
Length 10 mm 10 mm
Memory Density 131072 bit 131072 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 100 100
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 8KX16 8KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 1.5 mm
Supply Voltage-Max (Vsup) 2.6 V 2.6 V
Supply Voltage-Min (Vsup) 2.4 V 2.4 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 10 mm 10 mm
Base Number Matches 2 7
Pbfree Code No
Manufacturer Package Code BF100
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 225

Compare IDT70T25L20BF with alternatives

Compare 70T25L20BF with alternatives