IDT70P24L25BYI vs CYDMX064A16-90BVXI feature comparison

IDT70P24L25BYI Integrated Device Technology Inc

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CYDMX064A16-90BVXI Cypress Semiconductor

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description BGA, 6 X 6 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, MO-195C, VFBGA-100
Pin Count 100 100
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 90 ns
JESD-30 Code S-PBGA-B100 S-PBGA-B100
JESD-609 Code e0 e1
Memory Density 65536 bit 65536 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 16 16
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 100 100
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 4KX16 4KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA VFBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
Base Number Matches 1 1
Additional Feature IT CAN OPERATE ALSO 2.5 AND 3.3 VOLT
Length 6 mm
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1 mm
Terminal Pitch 0.5 mm
Time@Peak Reflow Temperature-Max (s) 20
Width 6 mm

Compare IDT70P24L25BYI with alternatives

Compare CYDMX064A16-90BVXI with alternatives