IDT70927S55PF vs 70V27S55BFG8 feature comparison

IDT70927S55PF Integrated Device Technology Inc

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70V27S55BFG8 Integrated Device Technology Inc

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP
Package Description LFQFP, BGA,
Pin Count 100
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 55 ns
Additional Feature AUTOMATIC POWER-DOWN
JESD-30 Code S-PQFP-G100 S-PBGA-B144
JESD-609 Code e0 e3
Length 14 mm
Memory Density 524288 bit 524288 bit
Memory IC Type MULTI-PORT SRAM DUAL-PORT SRAM
Memory Width 16 16
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Ports 2
Number of Terminals 100 144
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode SYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 32KX16 32KX16
Output Characteristics 3-STATE
Output Enable YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP BGA
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 1.6 mm
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) MATTE TIN
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm
Terminal Position QUAD BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 14 mm
Base Number Matches 2 1

Compare IDT70927S55PF with alternatives

Compare 70V27S55BFG8 with alternatives