70V27S55BFG8
vs
IDT70V27S55BFG
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Package Description |
BGA,
|
LFBGA, BGA144,13X13,32
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
55 ns
|
55 ns
|
JESD-30 Code |
S-PBGA-B144
|
S-PBGA-B144
|
JESD-609 Code |
e3
|
e3
|
Memory Density |
524288 bit
|
524288 bit
|
Memory IC Type |
DUAL-PORT SRAM
|
MULTI-PORT SRAM
|
Memory Width |
16
|
16
|
Number of Functions |
1
|
1
|
Number of Terminals |
144
|
144
|
Number of Words |
32768 words
|
32768 words
|
Number of Words Code |
32000
|
32000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
32KX16
|
32KX16
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
LFBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
BALL
|
BALL
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Part Package Code |
|
BGA
|
Pin Count |
|
144
|
I/O Type |
|
COMMON
|
Length |
|
12 mm
|
Number of Ports |
|
2
|
Output Characteristics |
|
3-STATE
|
Package Equivalence Code |
|
BGA144,13X13,32
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
1.5 mm
|
Standby Current-Max |
|
0.006 A
|
Standby Voltage-Min |
|
3 V
|
Supply Current-Max |
|
0.225 mA
|
Terminal Pitch |
|
0.8 mm
|
Width |
|
12 mm
|
|
|
|
Compare 70V27S55BFG8 with alternatives
Compare IDT70V27S55BFG with alternatives