70V27S55BFG8 vs IDT70V27S55BFG feature comparison

70V27S55BFG8 Integrated Device Technology Inc

Buy Now Datasheet

IDT70V27S55BFG Integrated Device Technology Inc

Buy Now Datasheet
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Package Description BGA, LFBGA, BGA144,13X13,32
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 55 ns
JESD-30 Code S-PBGA-B144 S-PBGA-B144
JESD-609 Code e3 e3
Memory Density 524288 bit 524288 bit
Memory IC Type DUAL-PORT SRAM MULTI-PORT SRAM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 144 144
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 32KX16 32KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LFBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish MATTE TIN MATTE TIN
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code BGA
Pin Count 144
I/O Type COMMON
Length 12 mm
Number of Ports 2
Output Characteristics 3-STATE
Package Equivalence Code BGA144,13X13,32
Qualification Status Not Qualified
Seated Height-Max 1.5 mm
Standby Current-Max 0.006 A
Standby Voltage-Min 3 V
Supply Current-Max 0.225 mA
Terminal Pitch 0.8 mm
Width 12 mm

Compare 70V27S55BFG8 with alternatives

Compare IDT70V27S55BFG with alternatives