IDT70825L20PFI vs IDT70825L20GG feature comparison

IDT70825L20PFI Integrated Device Technology Inc

Buy Now Datasheet

IDT70825L20GG Integrated Device Technology Inc

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP PGA
Package Description TQFP-80 PGA-84
Pin Count 80 84
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 20 ns 20 ns
JESD-30 Code S-PQFP-G80 S-CPGA-P84
JESD-609 Code e0 e3
Length 14 mm 27.94 mm
Memory Density 131072 bit 131072 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 80 84
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 8KX16 8KX16
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code LQFP PGA
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 5.207 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form GULL WING PIN/PEG
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position QUAD PERPENDICULAR
Time@Peak Reflow Temperature-Max (s) 20
Width 14 mm 27.94 mm
Base Number Matches 2 1
Pbfree Code Yes
Additional Feature AUTOMATIC POWER-DOWN

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