IDT7007L25GB8 vs IDT70V07S25PFI feature comparison

IDT7007L25GB8 Integrated Device Technology Inc

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IDT70V07S25PFI Integrated Device Technology Inc

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Reach Compliance Code not_compliant compliant
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 25 ns
I/O Type COMMON
JESD-30 Code S-XPGA-P68 S-PQFP-G80
JESD-609 Code e0 e0
Memory Density 262144 bit 262144 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 8 8
Number of Ports 2
Number of Terminals 68 80
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 32KX8 32KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC PLASTIC/EPOXY
Package Code PGA LQFP
Package Equivalence Code PGA68,11X11
Package Shape SQUARE SQUARE
Package Style GRID ARRAY FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B
Standby Current-Max 0.01 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.305 mA
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form PIN/PEG GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position PERPENDICULAR QUAD
Base Number Matches 1 1
Part Package Code QFP
Package Description LQFP,
Pin Count 80
Length 14 mm
Moisture Sensitivity Level 3
Number of Functions 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 1.6 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 14 mm

Compare IDT7007L25GB8 with alternatives

Compare IDT70V07S25PFI with alternatives