IDT7006L20GGI vs 70T06L20BF feature comparison

IDT7006L20GGI Integrated Device Technology Inc

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70T06L20BF Integrated Device Technology Inc

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code PGA CABGA
Package Description PGA, LFBGA,
Pin Count 68 100
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 20 ns 20 ns
JESD-30 Code S-CPGA-P68 S-PBGA-B100
JESD-609 Code e3 e0
Length 27.889 mm 10 mm
Memory Density 131072 bit 131072 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 68 100
Number of Words 16384 words 16384 words
Number of Words Code 16000 16000
Operating Mode ASYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 16KX8 16KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code PGA LFBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.413 mm 1.4 mm
Supply Voltage-Max (Vsup) 5.5 V 2.6 V
Supply Voltage-Min (Vsup) 4.5 V 2.4 V
Supply Voltage-Nom (Vsup) 5 V 2.5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish MATTE TIN TIN LEAD
Terminal Form PIN/PEG BALL
Terminal Pitch 2.54 mm 0.8 mm
Terminal Position PERPENDICULAR BOTTOM
Width 27.889 mm 10 mm
Base Number Matches 1 5
Manufacturer Package Code BF100
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 225

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