IDT7006L20GGI
vs
70T06L20BF
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
PGA
|
CABGA
|
Package Description |
PGA,
|
LFBGA,
|
Pin Count |
68
|
100
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
20 ns
|
20 ns
|
JESD-30 Code |
S-CPGA-P68
|
S-PBGA-B100
|
JESD-609 Code |
e3
|
e0
|
Length |
27.889 mm
|
10 mm
|
Memory Density |
131072 bit
|
131072 bit
|
Memory IC Type |
MULTI-PORT SRAM
|
MULTI-PORT SRAM
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
68
|
100
|
Number of Words |
16384 words
|
16384 words
|
Number of Words Code |
16000
|
16000
|
Operating Mode |
ASYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
16KX8
|
16KX8
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
Package Code |
PGA
|
LFBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.413 mm
|
1.4 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
2.6 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
2.4 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
2.5 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
MATTE TIN
|
TIN LEAD
|
Terminal Form |
PIN/PEG
|
BALL
|
Terminal Pitch |
2.54 mm
|
0.8 mm
|
Terminal Position |
PERPENDICULAR
|
BOTTOM
|
Width |
27.889 mm
|
10 mm
|
Base Number Matches |
1
|
5
|
Manufacturer Package Code |
|
BF100
|
Additional Feature |
|
FLOW-THROUGH OR PIPELINED ARCHITECTURE
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
225
|
|
|
|
Compare IDT7006L20GGI with alternatives
Compare 70T06L20BF with alternatives