70T06L20BF
vs
70V06S20GGI8
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
CABGA
|
|
Package Description |
LFBGA,
|
PGA-68
|
Pin Count |
100
|
|
Manufacturer Package Code |
BF100
|
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
20 ns
|
20 ns
|
Additional Feature |
FLOW-THROUGH OR PIPELINED ARCHITECTURE
|
|
JESD-30 Code |
S-PBGA-B100
|
S-CPGA-P68
|
JESD-609 Code |
e0
|
|
Length |
10 mm
|
|
Memory Density |
131072 bit
|
131072 bit
|
Memory IC Type |
MULTI-PORT SRAM
|
DUAL-PORT SRAM
|
Memory Width |
8
|
8
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
100
|
68
|
Number of Words |
16384 words
|
16384 words
|
Number of Words Code |
16000
|
16000
|
Operating Mode |
SYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
16KX8
|
16KX8
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
LFBGA
|
PGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
225
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.4 mm
|
|
Supply Voltage-Max (Vsup) |
2.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
2.4 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
2.5 V
|
3.3 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
BALL
|
PIN/PEG
|
Terminal Pitch |
0.8 mm
|
|
Terminal Position |
BOTTOM
|
PERPENDICULAR
|
Width |
10 mm
|
|
Base Number Matches |
2
|
1
|
|
|
|
Compare 70T06L20BF with alternatives
Compare 70V06S20GGI8 with alternatives