IDT6167LA25SO8 vs MAR5114CB feature comparison

IDT6167LA25SO8 Integrated Device Technology Inc

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MAR5114CB Zarlink Semiconductor Inc

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC ZARLINK SEMICONDUCTOR INC
Part Package Code SOIC
Package Description SOP, DIP, DIP18,.3
Pin Count 20
Reach Compliance Code compliant unknown
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 135 ns
JESD-30 Code R-PDSO-G20 R-XDIP-T18
JESD-609 Code e0 e0
Length 12.8 mm
Memory Density 16384 bit 4096 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 1 4
Number of Functions 1
Number of Ports 1
Number of Terminals 20 18
Number of Words 16384 words 1024 words
Number of Words Code 16000 1000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 16KX1 1KX4
Output Characteristics 3-STATE 3-STATE
Output Enable NO
Package Body Material PLASTIC/EPOXY CERAMIC
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm
Standby Voltage-Min 2 V 2 V
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.5 mm
Base Number Matches 1 4
I/O Type COMMON
Package Equivalence Code DIP18,.3
Screening Level 38535Q/M;38534H;883B
Standby Current-Max 0.002 A
Supply Current-Max 0.035 mA
Total Dose 100k Rad(Si) V

Compare IDT6167LA25SO8 with alternatives

Compare MAR5114CB with alternatives