IDT6167LA20PG
vs
AM2148-35LCB
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
MSIS SEMICONDUCTOR INC
Part Package Code
DIP
Package Description
0.300 INCH, PLASTIC, DIP-20
QCCN, LCC18,.3X.35
Pin Count
20
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
20 ns
35 ns
JESD-30 Code
R-PDIP-T20
R-XQCC-N18
JESD-609 Code
e3
e0
Length
26.162 mm
Memory Density
16384 bit
4096 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
1
4
Number of Functions
1
Number of Ports
1
Number of Terminals
20
18
Number of Words
16384 words
1024 words
Number of Words Code
16000
1000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
16KX1
1KX4
Output Characteristics
3-STATE
3-STATE
Output Enable
NO
Package Body Material
PLASTIC/EPOXY
CERAMIC
Package Code
DIP
QCCN
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
4.191 mm
Standby Voltage-Min
2 V
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
MOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
MATTE TIN
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
QUAD
Width
7.62 mm
Base Number Matches
1
2
I/O Type
COMMON
Package Equivalence Code
LCC18,.3X.35
Supply Current-Max
0.18 mA
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