IDT23S08-1HDCGI
vs
CY2309SC-1H
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
RENESAS ELECTRONICS CORP
CYPRESS SEMICONDUCTOR CORP
Package Description
SOP, SOP16,.25
0.150 INCH, MS-012, SOIC-16
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
23S
2309
Input Conditioning
STANDARD
STANDARD
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e3
e0
Length
9.9314 mm
9.893 mm
Logic IC Type
PLL BASED CLOCK DRIVER
PLL BASED CLOCK DRIVER
Max I(ol)
0.012 A
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Inverted Outputs
Number of Terminals
16
16
Number of True Outputs
8
8
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP16,.25
SOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Same Edge Skew-Max (tskwd)
0.2 ns
0.25 ns
Seated Height-Max
1.7272 mm
1.727 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Matte Tin (Sn) - annealed
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
3.937 mm
3.8985 mm
fmax-Min
133.3 MHz
133.33 MHz
Base Number Matches
2
1
Pbfree Code
Part Package Code
SOIC
Pin Count
16
Propagation Delay (tpd)
8.7 ns
Technology
CMOS
Compare IDT23S08-1HDCGI with alternatives
Compare CY2309SC-1H with alternatives