IDT10480S15D
vs
AM100470ADCB
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
ADVANCED MICRO DEVICES INC
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
0.300 INCH, CERDIP-20
|
DIP, DIP18,.3
|
| Pin Count |
20
|
18
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
15 ns
|
25 ns
|
| I/O Type |
SEPARATE
|
SEPARATE
|
| JESD-30 Code |
R-GDIP-T20
|
R-GDIP-T18
|
| JESD-609 Code |
e0
|
e0
|
| Length |
25.3365 mm
|
22.86 mm
|
| Memory Density |
16384 bit
|
4096 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
18
|
| Number of Words |
16384 words
|
4096 words
|
| Number of Words Code |
16000
|
4000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
75 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Organization |
16KX1
|
4KX1
|
| Output Characteristics |
OPEN-EMITTER
|
OPEN-EMITTER
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP20,.3
|
DIP18,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
5.08 mm
|
| Surface Mount |
NO
|
NO
|
| Technology |
BICMOS
|
ECL
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
OTHER
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| Number of Ports |
|
1
|
| Output Enable |
|
NO
|
| Supply Current-Max |
|
0.2 mA
|
|
|
|
Compare IDT10480S15D with alternatives
Compare AM100470ADCB with alternatives