IDT100474S2.7Y
vs
100474S2.7Y
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Contact Manufacturer
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Package Description |
SOJ, SOJ24,.34
|
0.300 INCH, 0.050 INCH PITCH, PLASTIC, MO-065AA, SOJ-24
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| Access Time-Max |
2.7 ns
|
2.7 ns
|
| I/O Type |
SEPARATE
|
SEPARATE
|
| JESD-30 Code |
R-PDSO-J24
|
R-PDSO-J24
|
| JESD-609 Code |
e0
|
e0
|
| Memory Density |
4096 bit
|
4096 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
4
|
4
|
| Moisture Sensitivity Level |
3
|
3
|
| Neg Supply Voltage-Nom |
-4.5 V
|
|
| Number of Terminals |
24
|
24
|
| Number of Words |
1024 words
|
1024 words
|
| Number of Words Code |
1000
|
1000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Organization |
1KX4
|
1KX4
|
| Output Characteristics |
OPEN-EMITTER
|
OPEN-EMITTER
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOJ
|
SOJ
|
| Package Equivalence Code |
SOJ24,.34
|
SOJ24,.34
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
225
|
225
|
| Power Supplies |
-4.5 V
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
Tin/Lead (Sn85Pb15)
|
Tin/Lead (Sn85Pb15)
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Base Number Matches |
1
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.32.00.41
|
| Length |
|
15.875 mm
|
| Number of Functions |
|
1
|
| Seated Height-Max |
|
3.7592 mm
|
| Technology |
|
BICMOS
|
| Width |
|
7.62 mm
|
|
|
|