Findchips: Compare ICSSSTUAF32868AHLFT vs SSTUA32864EC/G,518

ICSSSTUAF32868AHLFT vs SSTUA32864EC/G,518 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Pbfree Code	Yes
Rohs Code	Yes	Yes
Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	INTEGRATED DEVICE TECHNOLOGY INC	NXP SEMICONDUCTORS
Part Package Code	BGA	BGA
Package Description	LFBGA, BGA176,8X22,25	LFBGA,
Pin Count	176	96
Reach Compliance Code	compliant	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Family	32868	SSTU
JESD-30 Code	R-PBGA-B176	R-PBGA-B96
JESD-609 Code	e1
Length	15 mm	13.5 mm
Logic IC Type	D FLIP-FLOP	D FLIP-FLOP
Moisture Sensitivity Level	3	2
Number of Bits	28	25
Number of Functions	1	1
Number of Terminals	176	96
Operating Temperature-Max	70 °C	70 °C
Operating Temperature-Min
Output Polarity	TRUE	TRUE
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	LFBGA	LFBGA
Package Equivalence Code	BGA176,8X22,25
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)	260	NOT SPECIFIED
Propagation Delay (tpd)	3 ns	1.8 ns
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	1.55 mm	1.5 mm
Supply Voltage-Max (Vsup)	1.9 V	2 V
Supply Voltage-Min (Vsup)	1.7 V	1.7 V
Supply Voltage-Nom (Vsup)	1.8 V	1.8 V
Surface Mount	YES	YES
Temperature Grade	COMMERCIAL	COMMERCIAL
Terminal Finish	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form	BALL	BALL
Terminal Pitch	0.65 mm	0.8 mm
Terminal Position	BOTTOM	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30	NOT SPECIFIED
Trigger Type	POSITIVE EDGE	POSITIVE EDGE
Width	6 mm	5.5 mm
fmax-Min	410 MHz	450 MHz
Base Number Matches	1	1
Manufacturer Package Code		SOT536-1
	Logic » FF/Latches	Logic » FF/Latches