ICSSSTU32864YHLFT
vs
ICSSSTUF32864YHLFT
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
RENESAS ELECTRONICS CORP
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
LFBGA,
MO-205CC, BGA-96
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
SSTU
SSTU
JESD-30 Code
R-PBGA-B96
R-PBGA-B96
JESD-609 Code
e1
e3
Length
13.5 mm
13.5 mm
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Bits
25
25
Number of Functions
1
1
Number of Terminals
96
96
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Propagation Delay (tpd)
1.85 ns
2 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.5 mm
1.5 mm
Supply Voltage-Max (Vsup)
1.9 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
MATTE TIN
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
5.5 mm
5.5 mm
fmax-Min
270 MHz
270 MHz
Base Number Matches
2
2
Pbfree Code
Part Package Code
BGA
Pin Count
96
Compare ICSSSTU32864YHLFT with alternatives
Compare ICSSSTUF32864YHLFT with alternatives