ICSSSTU32864YHLFT vs SSTUH32864EC,551 feature comparison

ICSSSTU32864YHLFT Renesas Electronics Corporation

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SSTUH32864EC,551 NXP Semiconductors

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Rohs Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP NXP SEMICONDUCTORS
Package Description LFBGA, LFBGA,
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family SSTU SSTU
JESD-30 Code R-PBGA-B96 R-PBGA-B96
JESD-609 Code e1
Length 13.5 mm 13.5 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 25 14
Number of Functions 1 1
Number of Terminals 96 96
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Polarity TRUE COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Propagation Delay (tpd) 1.85 ns 1.8 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 1.5 mm
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 5.5 mm 5.5 mm
fmax-Min 270 MHz 450 MHz
Base Number Matches 2 1
Part Package Code BGA
Pin Count 96
Manufacturer Package Code SOT536-1
Output Characteristics OPEN-DRAIN
Technology CMOS

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Compare SSTUH32864EC,551 with alternatives