ICS97U877AHLF vs IDTCSPU877BV8 feature comparison

ICS97U877AHLF Integrated Device Technology Inc

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IDTCSPU877BV8 Integrated Device Technology Inc

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA BGA
Package Description VFBGA, BGA52,6X10,25 VFBGA, BGA52,6X10,25
Pin Count 52 52
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 97U CSPU877
Input Conditioning DIFFERENTIAL DIFFERENTIAL
JESD-30 Code R-PBGA-B52 R-XBGA-B52
JESD-609 Code e1 e0
Length 7 mm 7 mm
Logic IC Type PLL BASED CLOCK DRIVER PLL BASED CLOCK DRIVER
Max I(ol) 0.009 A 0.009 A
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Inverted Outputs
Number of Terminals 52 52
Number of True Outputs 10 10
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code VFBGA VFBGA
Package Equivalence Code BGA52,6X10,25 BGA52,6X10,25
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 225
Qualification Status Not Qualified Not Qualified
Same Edge Skew-Max (tskwd) 0.04 ns 0.04 ns
Seated Height-Max 1 mm 1 mm
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 20
Width 4.5 mm 4.5 mm
fmax-Min 350 MHz 340 MHz
Base Number Matches 3 1
Technology CMOS

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