ICS853L022AM
vs
SY89222LMG-TR
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
SOIC
|
|
Package Description |
SOP,
|
2 X 2 MM, LEAD FREE, MLF-8
|
Pin Count |
8
|
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
ECL MODE : VEE = -2.375V TO -5.25V WITH VCC=0V
|
|
Delay-Max |
0.75 ns
|
0.6 ns
|
Interface IC Type |
TTL/CMOS TO PECL TRANSLATOR
|
LVTTL/TTL TO LVPECL/PECL TRANSLATOR
|
JESD-30 Code |
R-PDSO-G8
|
S-PDSO-N8
|
JESD-609 Code |
e0
|
e4
|
Length |
4.9 mm
|
2 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Bits |
1
|
1
|
Number of Functions |
2
|
2
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Latch or Register |
NONE
|
NONE
|
Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
HVSON
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
240
|
260
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.75 mm
|
0.9754 mm
|
Supply Voltage-Max |
5.25 V
|
3.8 V
|
Supply Voltage-Min |
2.375 V
|
3 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
1.27 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
20
|
40
|
Width |
3.9 mm
|
2 mm
|
Base Number Matches |
1
|
1
|
Factory Lead Time |
|
4 Weeks
|
Samacsys Manufacturer |
|
Microchip
|
Package Equivalence Code |
|
SOLCC8,.08,20
|
Supply Current-Max |
|
25 mA
|
|
|
|
Compare ICS853L022AM with alternatives
Compare SY89222LMG-TR with alternatives