ICS853L022AG
vs
MC100ES60T22EFR2
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
TSSOP
|
SOIC
|
| Package Description |
TSSOP,
|
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
ECL MODE : VEE = -2.375V TO -5.25V WITH VCC=0V
|
|
| Delay-Max |
0.75 ns
|
|
| Interface IC Type |
TTL/CMOS TO PECL TRANSLATOR
|
TTL/CMOS TO PECL TRANSLATOR
|
| JESD-30 Code |
S-PDSO-G8
|
R-PDSO-G8
|
| JESD-609 Code |
e0
|
e3
|
| Length |
3 mm
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Bits |
1
|
|
| Number of Functions |
2
|
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Latch or Register |
NONE
|
|
| Output Polarity |
COMPLEMENTARY
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
SOP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
|
| Supply Voltage-Max |
5.25 V
|
|
| Supply Voltage-Min |
2.375 V
|
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
3 mm
|
|
| Base Number Matches |
1
|
1
|
| Manufacturer Package Code |
|
DCG8
|
| Package Equivalence Code |
|
SOP8,.25
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Technology |
|
ECL100K
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare ICS853L022AG with alternatives
Compare MC100ES60T22EFR2 with alternatives