ICS8535AG-01LF
vs
SY89834UMITR
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
MICREL INC
Part Package Code
TSSOP
DFN
Package Description
4.40 X 6.50 MM, 0.92 MM HEIGHT, ROHS COMPLIANT, MO-153, TSSOP-20
HVQCCN, LCC16,.12SQ,20
Pin Count
20
16
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
8535
89834
Input Conditioning
MUX
MUX
JESD-30 Code
R-PDSO-G20
S-XQCC-N16
JESD-609 Code
e3
e0
Length
6.5 mm
3 mm
Logic IC Type
LOW SKEW CLOCK DRIVER
LOW SKEW CLOCK DRIVER
Moisture Sensitivity Level
1
2
Number of Functions
1
1
Number of Inverted Outputs
4
Number of Terminals
20
16
Number of True Outputs
4
4
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
TSSOP
HVQCCN
Package Equivalence Code
TSSOP20,.25
LCC16,.12SQ,20
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
260
240
Prop. Delay@Nom-Sup
1.9 ns
0.5 ns
Propagation Delay (tpd)
1.9 ns
0.5 ns
Qualification Status
Not Qualified
Not Qualified
Same Edge Skew-Max (tskwd)
0.03 ns
0.02 ns
Seated Height-Max
1.2 mm
0.95 mm
Supply Voltage-Max (Vsup)
3.465 V
3.63 V
Supply Voltage-Min (Vsup)
3.135 V
2.375 V
Supply Voltage-Nom (Vsup)
3.3 V
2.5 V
Surface Mount
YES
YES
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn) - annealed
Tin/Lead (Sn85Pb15)
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.65 mm
0.5 mm
Terminal Position
DUAL
QUAD
Time@Peak Reflow Temperature-Max (s)
30
30
Width
4.4 mm
3 mm
Base Number Matches
2
2
Manufacturer Package Code
MLF
Additional Feature
ALSO OPERATES AT 3.3V SUPPLY
Packing Method
TR
fmax-Min
1000 MHz
Compare ICS8535AG-01LF with alternatives
Compare SY89834UMITR with alternatives