ICS8535AG-01LF
vs
SY58606UMG
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
TSSOP
Package Description
4.40 X 6.50 MM, 0.92 MM HEIGHT, ROHS COMPLIANT, MO-153, TSSOP-20
HVQCCN, LCC16,.12SQ,20
Pin Count
20
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
5A991.B.1
HTS Code
8542.39.00.01
8542.39.00.01
Family
8535
58606
Input Conditioning
MUX
DIFFERENTIAL
JESD-30 Code
R-PDSO-G20
S-XQCC-N16
JESD-609 Code
e3
e4
Length
6.5 mm
3 mm
Logic IC Type
LOW SKEW CLOCK DRIVER
LOW SKEW CLOCK DRIVER
Moisture Sensitivity Level
1
2
Number of Functions
1
1
Number of Inverted Outputs
Number of Terminals
20
16
Number of True Outputs
4
2
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
TSSOP
HVQCCN
Package Equivalence Code
TSSOP20,.25
LCC16,.12SQ,20
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
1.9 ns
0.4 ns
Propagation Delay (tpd)
1.9 ns
0.4 ns
Qualification Status
Not Qualified
Not Qualified
Same Edge Skew-Max (tskwd)
0.03 ns
0.015 ns
Seated Height-Max
1.2 mm
0.95 mm
Supply Voltage-Max (Vsup)
3.465 V
2.625 V
Supply Voltage-Min (Vsup)
3.135 V
2.375 V
Supply Voltage-Nom (Vsup)
3.3 V
2.5 V
Surface Mount
YES
YES
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn) - annealed
NICKEL PALLADIUM GOLD
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.65 mm
0.5 mm
Terminal Position
DUAL
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Width
4.4 mm
3 mm
Base Number Matches
2
1
Factory Lead Time
8 Weeks
Samacsys Manufacturer
Microchip
Additional Feature
CAN ALSO OPERATE WITH 3.3V SUPPLY
Packing Method
TUBE
Power Supply Current-Max (ICC)
77 mA
fmax-Min
3000 MHz
Compare ICS8535AG-01LF with alternatives
Compare SY58606UMG with alternatives