ICS507M-01DSW vs 507M-01ILF feature comparison

ICS507M-01DSW Integrated Device Technology Inc

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507M-01ILF Integrated Device Technology Inc

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code DIE SOIC
Package Description DIE, SOIC-16
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code X-XUUC-N R-PDSO-G16
JESD-609 Code e0 e3
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Output Clock Frequency-Max 200 MHz 125 MHz
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIE SOP
Package Shape UNSPECIFIED RECTANGULAR
Package Style UNCASED CHIP SMALL OUTLINE
Primary Clock/Crystal Frequency-Nom 52 MHz 52 MHz
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max 5.5 V 5.25 V
Supply Voltage-Min 3 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form NO LEAD GULL WING
Terminal Position UPPER DUAL
uPs/uCs/Peripheral ICs Type CLOCK GENERATOR, OTHER CLOCK GENERATOR, OTHER
Base Number Matches 1 2
Pin Count 16
Manufacturer Package Code DCG16
Length 9.9 mm
Moisture Sensitivity Level 3
Number of Terminals 16
Package Equivalence Code SOP16,.25
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.75 mm
Supply Current-Max 63 mA
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm

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