ICS507M-01DSW
vs
507M-01T
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
DIE
SOIC
Package Description
DIE,
SOIC-16
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
X-XUUC-N
R-PDSO-G16
JESD-609 Code
e0
e0
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Output Clock Frequency-Max
200 MHz
200 MHz
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
DIE
SOP
Package Shape
UNSPECIFIED
RECTANGULAR
Package Style
UNCASED CHIP
SMALL OUTLINE
Primary Clock/Crystal Frequency-Nom
52 MHz
52 MHz
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max
5.5 V
5.25 V
Supply Voltage-Min
3 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
NO LEAD
GULL WING
Terminal Position
UPPER
DUAL
uPs/uCs/Peripheral ICs Type
CLOCK GENERATOR, OTHER
CLOCK GENERATOR, OTHER
Base Number Matches
1
1
Pin Count
16
Length
9.9 mm
Moisture Sensitivity Level
1
Number of Terminals
16
Package Equivalence Code
SOP16,.25
Peak Reflow Temperature (Cel)
240
Seated Height-Max
1.75 mm
Terminal Pitch
1.27 mm
Time@Peak Reflow Temperature-Max (s)
30
Width
3.9 mm
Compare ICS507M-01DSW with alternatives
Compare 507M-01T with alternatives