ICS1893BFLF
vs
ICS1893BKLFT
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
End Of Life
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Package Description |
0.300 INCH, LEAD FREE, SSOP-48
|
8 X 8 MM, LEAD FREE, PLASTIC, MO-220VLLD-5, MLF2-56
|
| Reach Compliance Code |
compliant
|
unknown
|
| Data Rate |
100000 Mbps
|
100000 Mbps
|
| JESD-30 Code |
R-PDSO-G48
|
S-PQCC-N56
|
| JESD-609 Code |
e3
|
e3
|
| Length |
15.875 mm
|
8 mm
|
| Moisture Sensitivity Level |
1
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
48
|
56
|
| Number of Transceivers |
1
|
1
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SSOP
|
HVQCCN
|
| Package Equivalence Code |
SSOP48,.4
|
LCC56,.31SQ,20
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.8 mm
|
1 mm
|
| Supply Current-Max |
0.16 mA
|
0.16 mA
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
Matte Tin (Sn) - annealed
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.635 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
7.5 mm
|
8 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
QFN
|
| Pin Count |
|
56
|
| HTS Code |
|
8542.39.00.01
|
|
|
|
Compare ICS1893BFLF with alternatives
Compare ICS1893BKLFT with alternatives