ICM7555IN/01,112
vs
LM555CMX
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NATIONAL SEMICONDUCTOR CORP
Part Package Code
DIP
Package Description
DIP, DIP8,.3
SOIC-8
Pin Count
8
Manufacturer Package Code
SOT97-1
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
PULSE
TIMER
JESD-30 Code
R-PDIP-T8
R-PDSO-G8
JESD-609 Code
e4
e0
Length
9.5 mm
4.9 mm
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Output Frequency-Max
0.5 MHz
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP8,.3
SOP8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
235
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.2 mm
1.75 mm
Supply Voltage-Max (Vsup)
16 V
16 V
Supply Voltage-Min (Vsup)
3 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
BIPOLAR
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
30
Width
7.62 mm
3.9 mm
Base Number Matches
1
4
Moisture Sensitivity Level
1
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