ICM7555IN/01,112
vs
ICM7555ESA+T
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
MAXIM INTEGRATED PRODUCTS INC
Part Package Code
DIP
SOIC
Package Description
DIP, DIP8,.3
SOP, SOP8,.25
Pin Count
8
8
Manufacturer Package Code
SOT97-1
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
PULSE
SQUARE
JESD-30 Code
R-PDIP-T8
R-PDSO-G8
JESD-609 Code
e4
e3
Length
9.5 mm
4.9 mm
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Frequency-Max
0.5 MHz
0.5 MHz
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP8,.3
SOP8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.2 mm
1.75 mm
Supply Voltage-Max (Vsup)
16 V
18 V
Supply Voltage-Min (Vsup)
3 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
MATTE TIN
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
30
Width
7.62 mm
3.9 mm
Base Number Matches
1
2
Pbfree Code
Moisture Sensitivity Level
1
Supply Current-Max (Isup)
0.12 mA
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ICM7555IN/01,112 vs LM555CMX
ICM7555IN/01,112 vs ICM7555ID,602
ICM7555IN/01,112 vs ICM7555CBA-T
ICM7555IN/01,112 vs KA555IDTF
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ICM7555IN/01,112 vs NE555D
Compare ICM7555ESA+T with alternatives