ICM7555CBA-T
vs
ICM7555ESA+T
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
HARRIS SEMICONDUCTOR
MAXIM INTEGRATED PRODUCTS INC
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
JESD-609 Code
e0
e3
Number of Terminals
8
8
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP8,.25
SOP8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Base Number Matches
4
2
Pbfree Code
Part Package Code
SOIC
Package Description
SOP, SOP8,.25
Pin Count
8
Analog IC - Other Type
SQUARE
Length
4.9 mm
Moisture Sensitivity Level
1
Number of Functions
1
Output Frequency-Max
0.5 MHz
Peak Reflow Temperature (Cel)
260
Seated Height-Max
1.75 mm
Supply Current-Max (Isup)
0.12 mA
Supply Voltage-Max (Vsup)
18 V
Supply Voltage-Min (Vsup)
2 V
Supply Voltage-Nom (Vsup)
5 V
Time@Peak Reflow Temperature-Max (s)
30
Width
3.9 mm
Compare ICM7555CBA-T with alternatives
Compare ICM7555ESA+T with alternatives