ICL8038AMJD vs ICL8038BMDD/C feature comparison

ICL8038AMJD Intersil Corporation

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ICL8038BMDD/C General Electric Solid State

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTERSIL CORP GENERAL ELECTRIC SOLID STATE
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type WAVEFORM GENERATION WAVEFORM GENERATION
JESD-30 Code R-XDIP-T14 R-XDIP-T14
JESD-609 Code e0 e0
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC CERAMIC
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 3 1
Package Description DIP, DIP14,.3
Screening Level MIL-STD-883 Class C

Compare ICL8038AMJD with alternatives

Compare ICL8038BMDD/C with alternatives