IC61SF51218T-8.5TQI vs IDT71T658S133BG feature comparison

IC61SF51218T-8.5TQI Integrated Silicon Solution Inc

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IDT71T658S133BG Integrated Device Technology Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC INTEGRATED DEVICE TECHNOLOGY INC
Package Description 14 X 20 MM, 1.40 MM HEIGHT, TQFP-100 BGA,
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 8.5 ns 4.2 ns
Clock Frequency-Max (fCLK) 100 MHz
I/O Type COMMON
JESD-30 Code R-PQFP-G100 R-PBGA-B119
JESD-609 Code e0 e0
Memory Density 9437184 bit 9437184 bit
Memory IC Type STANDARD SRAM ZBT SRAM
Memory Width 18 18
Number of Functions 1 1
Number of Terminals 100 119
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 512KX18 512KX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP BGA
Package Equivalence Code QFP100,.63X.87
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.09 A
Standby Voltage-Min 2.38 V
Supply Current-Max 0.3 mA
Supply Voltage-Max (Vsup) 3.63 V 2.625 V
Supply Voltage-Min (Vsup) 3.135 V 2.375 V
Supply Voltage-Nom (Vsup) 3.3 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form GULL WING BALL
Terminal Pitch 0.635 mm 1.27 mm
Terminal Position QUAD BOTTOM
Base Number Matches 1 1
Pbfree Code No
Part Package Code BGA
Pin Count 119
Additional Feature ALSO REQUIRES 2.5V I/O SUPPLY
Length 22 mm
Moisture Sensitivity Level 3
Seated Height-Max 3.5 mm
Width 14 mm

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