IBM25PPC750GXECR2532T
vs
IBM25PPC750GLECB2HA3T
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
IBM MICROELECTRONICS
IBM MICROELECTRONICS
Part Package Code
BGA
BGA
Package Description
21 X 21 MM, 1 MM PITCH, LEAD FREE, CERAMIC, BGA-292
21 X 21 MM, 1 MM PITCH, ROHS COMPLIANT, CERAMIC, BGA-292
Pin Count
292
292
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
200 MHz
200 MHz
External Data Bus Width
64
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-CBGA-B292
S-CBGA-B292
JESD-609 Code
e1
e1
Length
21 mm
21 mm
Low Power Mode
YES
YES
Number of Terminals
292
292
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.137 mm
2.828 mm
Speed
800 MHz
800 MHz
Supply Voltage-Max
1.5 V
1.55 V
Supply Voltage-Min
1.4 V
1.45 V
Supply Voltage-Nom
1.45 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
Tin/Silver/Copper (Sn95.5Ag3.8Cu0.7)
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
21 mm
21 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
Pbfree Code
Compare IBM25PPC750GXECR2532T with alternatives
Compare IBM25PPC750GLECB2HA3T with alternatives