IBM25PPC750GXECR2532T
vs
IBM25PPC750FX-EB2533T
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
IBM MICROELECTRONICS
|
IBM MICROELECTRONICS
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
21 X 21 MM, 1 MM PITCH, LEAD FREE, CERAMIC, BGA-292
|
BGA, BGA292,20X20,40
|
| Pin Count |
292
|
292
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
32
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
200 MHz
|
200 MHz
|
| External Data Bus Width |
64
|
64
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-CBGA-B292
|
S-CBGA-B292
|
| JESD-609 Code |
e1
|
|
| Length |
21 mm
|
21.02 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
292
|
292
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
BGA
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.137 mm
|
3.087 mm
|
| Speed |
800 MHz
|
800 MHz
|
| Supply Voltage-Max |
1.5 V
|
1.5 V
|
| Supply Voltage-Min |
1.4 V
|
1.4 V
|
| Supply Voltage-Nom |
1.45 V
|
1.45 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
Tin/Silver/Copper (Sn95.5Ag3.8Cu0.7)
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
21 mm
|
21.02 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
1
|
| Package Equivalence Code |
|
BGA292,20X20,40
|
|
|
|
Compare IBM25PPC750GXECR2532T with alternatives
Compare IBM25PPC750FX-EB2533T with alternatives