IBM25PPC750FX-GB2532T
vs
IBM25PPC750GXECR2H33T
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
IBM MICROELECTRONICS
IBM MICROELECTRONICS
Part Package Code
BGA
BGA
Package Description
21 X 21 MM, 1 MM PITCH, CERAMIC, BGA-292
BGA,
Pin Count
292
292
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
kg CO2e/kg
12.2
12.2
Average Weight (mg)
2651.1
2651.1
CO2e (mg)
32343.421
32343.421
Total Weight
22164.19
Category CO2 Kg
12.2
12.2
CO2
270403.11799999996
Candidate List Date
2024-01-23
SVHC Over MCV
7439-92-1
CAS Accounted for Wt
19
CA Prop 65 Presence
YES
CA Prop 65 CAS Numbers
1309-64-4, 7440-02-0, 7440-38-2, 7440-43-9, 7439-92-1, 7440-48-4
Conflict Mineral Status
DRC Conflict Free Undeterminable
Conflict Mineral Status Source
FMD
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
200 MHz
200 MHz
External Data Bus Width
64
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-CBGA-B292
S-CBGA-B292
Length
21.02 mm
21 mm
Low Power Mode
YES
YES
Number of Terminals
292
292
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
BGA
BGA
Package Equivalence Code
BGA292,20X20,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.087 mm
3.137 mm
Speed
800 MHz
800 MHz
Supply Voltage-Max
1.5 V
1.5 V
Supply Voltage-Min
1.4 V
1.4 V
Supply Voltage-Nom
1.45 V
1.45 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
21.02 mm
21 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
Compare IBM25PPC750FX-GB2532T with alternatives
Compare IBM25PPC750GXECR2H33T with alternatives