IBM25PPC750CXEJQ7013T
vs
MC9328MXL15
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
IBM MICROELECTRONICS
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Part Package Code |
BGA
|
|
| Package Description |
LBGA, BGA256,20X20,50
|
FBGA, BGA256,16X16,32
|
| Pin Count |
256
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
|
| Address Bus Width |
32
|
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
|
| Clock Frequency-Max |
133 MHz
|
|
| External Data Bus Width |
64
|
|
| Format |
FLOATING POINT
|
|
| Integrated Cache |
YES
|
|
| JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
| Length |
27 mm
|
|
| Low Power Mode |
YES
|
|
| Number of Terminals |
256
|
256
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
FBGA
|
| Package Equivalence Code |
BGA256,20X20,50
|
BGA256,16X16,32
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.666 mm
|
|
| Speed |
600 MHz
|
150 MHz
|
| Supply Voltage-Max |
1.9 V
|
|
| Supply Voltage-Min |
1.7 V
|
|
| Supply Voltage-Nom |
1.8 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
27 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
3
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Power Supplies |
|
1.8,1.8/3.3 V
|
| Temperature Grade |
|
COMMERCIAL
|
|
|
|
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