IBM25PPC750CXEJQ7013T vs 79RC32V334100BBGI feature comparison

IBM25PPC750CXEJQ7013T IBM

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79RC32V334100BBGI Integrated Device Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer IBM MICROELECTRONICS INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA BGA
Package Description LBGA, BGA256,20X20,50 BGA, BGA256,16X16,40
Pin Count 256 256
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 133 MHz 50 MHz
External Data Bus Width 64 32
Format FLOATING POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
Length 27 mm 17 mm
Low Power Mode YES YES
Number of Terminals 256 256
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Equivalence Code BGA256,20X20,50 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.666 mm 3.5 mm
Speed 600 MHz 100 MHz
Supply Voltage-Max 1.9 V 3.465 V
Supply Voltage-Min 1.7 V 3.135 V
Supply Voltage-Nom 1.8 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 40
Width 27 mm 17 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Supply Current-Max 480 mA
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER

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