IBM25PPC750CXEJP7013T vs 79RC32T336150BCGI feature comparison

IBM25PPC750CXEJP7013T IBM

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79RC32T336150BCGI Integrated Device Technology Inc

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer IBM MICROELECTRONICS INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA BGA
Package Description 27 X 27 MM, PLASTIC, BGA-256 LBGA, BGA256,16X16,40
Pin Count 256 256
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 22
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 133 MHz 75 MHz
External Data Bus Width 64 32
Format FLOATING POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
Length 27 mm 17 mm
Low Power Mode YES YES
Number of Terminals 256 256
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA256,20X20,50 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.666 mm 1.7 mm
Speed 600 MHz 150 MHz
Supply Voltage-Max 1.9 V 2.625 V
Supply Voltage-Min 1.7 V 2.375 V
Supply Voltage-Nom 1.8 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 17 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Additional Feature ALSO REQUIRES 3.3V SUPPLY
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 260
Supply Current-Max 750 mA
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s) 30

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