79RC32T336150BCGI vs 79RC32T336-150BCG feature comparison

79RC32T336150BCGI Integrated Device Technology Inc

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79RC32T336-150BCG Integrated Device Technology Inc

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA BGA
Package Description LBGA, BGA256,16X16,40 LBGA, BGA256,16X16,40
Pin Count 256 256
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY
Address Bus Width 22 22
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 75 MHz 75 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1 e1
Length 17 mm 17 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 256 256
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Speed 150 MHz 150 MHz
Supply Current-Max 750 mA 750 mA
Supply Voltage-Max 2.625 V 2.625 V
Supply Voltage-Min 2.375 V 2.375 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 17 mm 17 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1

Compare 79RC32T336150BCGI with alternatives

Compare 79RC32T336-150BCG with alternatives