IBM25PPC750CXEJP7013T
vs
MCF5329CVM240
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Not Recommended
|
Ihs Manufacturer |
IBM MICROELECTRONICS
|
NXP SEMICONDUCTORS
|
Part Package Code |
BGA
|
|
Package Description |
27 X 27 MM, PLASTIC, BGA-256
|
17 X 17 MM, ROHS COMPLIANT, MAPBGA-256
|
Pin Count |
256
|
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
3A991.A.2
|
5A002.A.1
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
32
|
24
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
133 MHz
|
80 MHz
|
External Data Bus Width |
64
|
32
|
Format |
FLOATING POINT
|
FIXED POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
Length |
27 mm
|
17 mm
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
256
|
256
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Equivalence Code |
BGA256,20X20,50
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.666 mm
|
1.6 mm
|
Speed |
600 MHz
|
240 MHz
|
Supply Voltage-Max |
1.9 V
|
1.6 V
|
Supply Voltage-Min |
1.7 V
|
1.4 V
|
Supply Voltage-Nom |
1.8 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
27 mm
|
17 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
1
|
Factory Lead Time |
|
13 Weeks
|
Samacsys Manufacturer |
|
NXP
|
JESD-609 Code |
|
e1
|
Moisture Sensitivity Level |
|
3
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Peak Reflow Temperature (Cel) |
|
260
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Finish |
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare IBM25PPC750CXEJP7013T with alternatives
Compare MCF5329CVM240 with alternatives