79RC32T365180BC vs IBM25PPC750CXRKQ4024T feature comparison

79RC32T365180BC Integrated Device Technology Inc

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IBM25PPC750CXRKQ4024T IBM

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC IBM MICROELECTRONICS
Part Package Code BGA BGA
Package Description 17 X 17 MM, MO-192, CABGA-256 LBGA, BGA256,20X20,50
Pin Count 256 256
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 90 MHz 133 MHz
External Data Bus Width 32 64
Format FIXED POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0
Length 17 mm 27 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 256 256
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA256,16X16,40 BGA256,20X20,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.666 mm
Speed 180 MHz 466 MHz
Supply Voltage-Max 2.625 V 1.9 V
Supply Voltage-Min 2.375 V 1.8 V
Supply Voltage-Nom 2.5 V 1.85 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 17 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1

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Compare IBM25PPC750CXRKQ4024T with alternatives