IBM25PPC740-DB0M2000
vs
PC7448VSH1267ND
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Contact Manufacturer
Obsolete
Ihs Manufacturer
IBM MICROELECTRONICS
TELEDYNE E2V (UK) LTD
Part Package Code
BGA
BGA
Package Description
BGA,
BGA, BGA360,19X19,50
Pin Count
360
360
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
36
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
83.3 MHz
200 MHz
External Data Bus Width
64
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
NO
YES
JESD-30 Code
S-CBGA-B360
S-CBGA-B360
Length
25 mm
25 mm
Low Power Mode
YES
NO
Number of Terminals
360
360
Operating Temperature-Max
65 °C
110 °C
Operating Temperature-Min
-40 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.2 mm
2.4 mm
Speed
200 MHz
1267 MHz
Supply Voltage-Max
2.75 V
1.1 V
Supply Voltage-Min
2.65 V
1 V
Supply Voltage-Nom
2.7 V
1.05 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
25 mm
25 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
Rohs Code
Package Equivalence Code
BGA360,19X19,50
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare IBM25PPC740-DB0M2000 with alternatives
Compare PC7448VSH1267ND with alternatives