IBM25PPC405GP-3DE266C
vs
RTPXA320B2C806-646
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
IBM MICROELECTRONICS
|
MARVELL SEMICONDUCTOR INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
BGA, BGA456,26X26,40
|
VFBGA,
|
| Pin Count |
456
|
456
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
ALSO REQUIRES 3.3V SUPPLY
|
|
| Address Bus Width |
32
|
|
| Bit Size |
32
|
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
66.66 MHz
|
13.002 MHz
|
| External Data Bus Width |
32
|
|
| Format |
FIXED POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B456
|
S-PBGA-B456
|
| Length |
27 mm
|
14 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
456
|
456
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-25 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
VFBGA
|
| Package Equivalence Code |
BGA456,26X26,40
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
2.21 mm
|
1 mm
|
| Speed |
266.66 MHz
|
806 MHz
|
| Supply Voltage-Max |
2.7 V
|
|
| Supply Voltage-Min |
2.3 V
|
|
| Supply Voltage-Nom |
2.5 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
OTHER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
27 mm
|
14 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
3
|
1
|
|
|
|
Compare IBM25PPC405GP-3DE266C with alternatives
Compare RTPXA320B2C806-646 with alternatives