IBM25PPC405GP-3DE266C
vs
PPC405GPR3BB400Z
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
IBM MICROELECTRONICS
|
APPLIED MICRO CIRCUITS CORP
|
Part Package Code |
BGA
|
BGA
|
Package Description |
BGA, BGA456,26X26,40
|
35 X 35 MM, PLASTIC, EBGA-456
|
Pin Count |
456
|
456
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
3A991.A.2
|
|
HTS Code |
8542.31.00.01
|
|
Additional Feature |
ALSO REQUIRES 3.3V SUPPLY
|
ALSO REQUIRES 3.3V SUPPLY
|
Address Bus Width |
32
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
66.66 MHz
|
66.66 MHz
|
External Data Bus Width |
32
|
32
|
Format |
FIXED POINT
|
FIXED POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B456
|
S-PBGA-B456
|
Length |
27 mm
|
35 mm
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
456
|
456
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA456,26X26,40
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.21 mm
|
2.65 mm
|
Speed |
266.66 MHz
|
400 MHz
|
Supply Voltage-Max |
2.7 V
|
1.9 V
|
Supply Voltage-Min |
2.3 V
|
1.8 V
|
Supply Voltage-Nom |
2.5 V
|
1.85 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
27 mm
|
35 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
3
|
2
|
Rohs Code |
|
No
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare IBM25PPC405GP-3DE266C with alternatives
Compare PPC405GPR3BB400Z with alternatives