IBM11D1360E-70J
vs
KMM531003B-7
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
IBM MICROELECTRONICS
SAMSUNG SEMICONDUCTOR INC
Package Description
SIMM, SSIM72
,
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.02
8542.32.00.02
Access Time-Max
70 ns
70 ns
I/O Type
COMMON
JESD-30 Code
R-PSMA-N72
R-XSMA-N72
Memory Density
37748736 bit
37748736 bit
Memory IC Type
FAST PAGE DRAM MODULE
FAST PAGE DRAM MODULE
Memory Width
36
36
Number of Terminals
72
72
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
1MX36
1MX36
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
SIMM
SIMM
Package Equivalence Code
SSIM72
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
1024
Seated Height-Max
22.86 mm
Standby Current-Max
0.009 A
Supply Current-Max
0.63 mA
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
1.27 mm
Terminal Position
SINGLE
SINGLE
Base Number Matches
1
1
Part Package Code
SIMM
Pin Count
72
Access Mode
FAST PAGE
Number of Functions
1
Number of Ports
1
Compare IBM11D1360E-70J with alternatives
Compare KMM531003B-7 with alternatives