IBM041810ULAB-6 vs MCM69F618ZP10 feature comparison

IBM041810ULAB-6 IBM

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MCM69F618ZP10 Motorola Mobility LLC

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code End Of Life Obsolete
Ihs Manufacturer IBM MICROELECTRONICS MOTOROLA INC
Part Package Code BGA BGA
Package Description BGA, BGA119,7X17,50 BGA, BGA119,7X17,50
Pin Count 119 119
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 7 ns 10 ns
I/O Type COMMON COMMON
JESD-30 Code R-PBGA-B119 R-PBGA-B119
JESD-609 Code e0 e0
Length 22 mm 22 mm
Memory Density 1179648 bit 1179648 bit
Memory IC Type STANDARD SRAM CACHE SRAM
Memory Width 18 18
Number of Functions 1 1
Number of Terminals 119 119
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 64KX18 64KX18
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA119,7X17,50 BGA119,7X17,50
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.41 mm 2.4 mm
Standby Current-Max 0.025 A 0.01 A
Standby Voltage-Min 3.14 V 3.14 V
Supply Current-Max 0.45 mA 0.25 mA
Supply Voltage-Max (Vsup) 3.465 V 3.465 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS BICMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 14 mm
Base Number Matches 2 1
Additional Feature TEMP TJ = 20 TO 110 DEG C; SELF-TIMED WRITE; BYTE WRITE; LINEAR/INTERLEAVED BURST SEQUENCE
Number of Ports 1
Output Enable YES

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