MCM69F618ZP10
vs
MCM69L618ZP9.5R
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
MOTOROLA INC
|
Package Description |
BGA, BGA119,7X17,50
|
BGA,
|
Reach Compliance Code |
unknown
|
unknown
|
Access Time-Max |
10 ns
|
9.5 ns
|
I/O Type |
COMMON
|
|
JESD-30 Code |
R-PBGA-B119
|
R-PBGA-B119
|
JESD-609 Code |
e0
|
|
Memory Density |
1179648 bit
|
1179648 bit
|
Memory IC Type |
STANDARD SRAM
|
CACHE SRAM
|
Memory Width |
18
|
18
|
Number of Terminals |
119
|
119
|
Number of Words |
65536 words
|
65536 words
|
Number of Words Code |
64000
|
64000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Organization |
64KX18
|
64KX18
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA119,7X17,50
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Power Supplies |
3.3 V
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Standby Current-Max |
0.01 A
|
|
Standby Voltage-Min |
3.14 V
|
|
Supply Current-Max |
0.25 mA
|
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Base Number Matches |
3
|
2
|
Part Package Code |
|
BGA
|
Pin Count |
|
119
|
ECCN Code |
|
3A991.B.2.A
|
HTS Code |
|
8542.32.00.41
|
Length |
|
22 mm
|
Number of Functions |
|
1
|
Number of Ports |
|
1
|
Operating Temperature-Max |
|
70 °C
|
Operating Temperature-Min |
|
|
Output Enable |
|
YES
|
Seated Height-Max |
|
2.4 mm
|
Supply Voltage-Max (Vsup) |
|
3.6 V
|
Supply Voltage-Min (Vsup) |
|
3.15 V
|
Technology |
|
BICMOS
|
Temperature Grade |
|
COMMERCIAL
|
Width |
|
14 mm
|
|
|
|
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