MCM69F618ZP10 vs MCM69L618ZP9.5R feature comparison

MCM69F618ZP10 Freescale Semiconductor

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MCM69L618ZP9.5R Motorola Mobility LLC

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS MOTOROLA INC
Package Description BGA, BGA119,7X17,50 BGA,
Reach Compliance Code unknown unknown
Access Time-Max 10 ns 9.5 ns
I/O Type COMMON
JESD-30 Code R-PBGA-B119 R-PBGA-B119
JESD-609 Code e0
Memory Density 1179648 bit 1179648 bit
Memory IC Type STANDARD SRAM CACHE SRAM
Memory Width 18 18
Number of Terminals 119 119
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Organization 64KX18 64KX18
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA119,7X17,50
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Power Supplies 3.3 V
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.01 A
Standby Voltage-Min 3.14 V
Supply Current-Max 0.25 mA
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Base Number Matches 3 2
Part Package Code BGA
Pin Count 119
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Length 22 mm
Number of Functions 1
Number of Ports 1
Operating Temperature-Max 70 °C
Operating Temperature-Min
Output Enable YES
Seated Height-Max 2.4 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3.15 V
Technology BICMOS
Temperature Grade COMMERCIAL
Width 14 mm

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