IA82510PLC28IR2
vs
TN82510
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
INNOVASIC INC
|
INTEL CORP
|
Package Description |
ROHS COMPLIANT, PLASTIC, LCC-28
|
PLASTIC, LCC-28
|
Reach Compliance Code |
compliant
|
unknown
|
Address Bus Width |
3
|
3
|
Boundary Scan |
NO
|
NO
|
Clock Frequency-Max |
20 MHz
|
18.432 MHz
|
Communication Protocol |
ASYNC, BIT
|
ASYNC, BIT
|
External Data Bus Width |
8
|
8
|
JESD-30 Code |
S-PQCC-J28
|
R-PQCC-J28
|
Length |
11.505 mm
|
13.95 mm
|
Low Power Mode |
YES
|
YES
|
Number of Serial I/Os |
1
|
1
|
Number of Terminals |
28
|
28
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Equivalence Code |
LDCC28,.5SQ
|
LDCC28,.5SQ
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Seated Height-Max |
4.57 mm
|
3.56 mm
|
Supply Voltage-Nom |
5.5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
11.505 mm
|
8.89 mm
|
uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
Base Number Matches |
2
|
2
|
Part Package Code |
|
QLCC
|
Pin Count |
|
28
|
HTS Code |
|
8542.31.00.01
|
Bus Compatibility |
|
IBM PC-AT
|
Data Encoding/Decoding Method |
|
NRZ
|
Data Transfer Rate-Max |
|
0.03515625 MBps
|
JESD-609 Code |
|
e0
|
Number of DMA Channels |
|
|
Number of I/O Lines |
|
3
|
On Chip Data RAM Width |
|
|
Qualification Status |
|
Not Qualified
|
RAM (words) |
|
0
|
Supply Voltage-Max |
|
5.5 V
|
Supply Voltage-Min |
|
4.5 V
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
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