I1730SY01 vs ISD5008X feature comparison

I1730SY01 Winbond Electronics Corp

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ISD5008X Nuvoton Technology Corp

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer WINBOND ELECTRONICS CORP INFORMATION STORAGE DEVICES
Part Package Code SOIC DIE
Package Description SOP, DIE,
Pin Count 28 25
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code R-PDSO-G28 R-XUUC-N25
JESD-609 Code e3
Length 17.93 mm
Number of Functions 1
Number of Terminals 28 25
On Chip Memory Type FLASH
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code SOP DIE
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE UNCASED CHIP
Qualification Status Not Qualified Not Qualified
Reading Time-Max 60 s
Seated Height-Max 2.64 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 2.4 V
Surface Mount YES YES
Temperature Grade COMMERCIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING NO LEAD
Terminal Pitch 1.27 mm
Terminal Position DUAL UPPER
Width 7.52 mm
Base Number Matches 1 2

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